| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| SI4401BDY-T1-E3 | VISHAY/威世 | SOP8 | 1365 | 2026-06-01 | ||||
| STM32F103ZCT6 | ST/意法 | QFP | 62 | 2026-06-01 | ||||
| ADUCM320BBCZI-RL | ADI/亚德诺 | BGA | 27 | 2026-06-01 | ||||
| R7S721020VCBG#AC1 | RENESAS/瑞萨 | BGA | 12 | 2026-06-01 | ||||
| XC5VTX150T-2FFG1759I | XILINX/赛灵思 | BGA | 98 | 2026-06-01 | ||||
| XC5VLX110T-1FF1136C | XILINX/赛灵思 | BGA | 130 | 2026-06-01 | ||||
| XC4VLX40-10FF1148C | XILINX/赛灵思 | BGA | 15 | 2026-06-01 | ||||
| XC4VLX60-12FF1148C | XILINX/赛灵思 | BGA | 3 | 2026-06-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| XC2VP20-5FF896C | XILINX/赛灵思 | BGA | 1 | 2026-06-01 | ||||
| PAS414HR-VG1 | TAIYO/太诱 | SMD | 15+ | 604 | 2026-06-01 | |||
| MAX961EUA | MAXIM/美信 | MSOP8 | 13+ | 25 | 2026-06-01 | |||
| TQM8M9079 | QORVO | QFN-20 | 17+ | 22 | 2026-06-01 | |||
| S-24CS16A0I-J8T1G | SEIKO/精工 | SOP8 | 10+ | 223 | 2026-06-01 | |||
| PCF8593T | NXP/恩智浦 | SOP8 | 18+ | 871 | 2026-06-01 | |||
| EP1S10F672I7 | ALTERA/阿尔特拉 | BGA | 23 | 2026-06-01 | ||||
| EPM7512AEFI256-10 | ALTERA/阿尔特拉 | BGA | 98 | 2026-06-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| XC4VLX60-12FF1148C | XILINX/赛灵思 | BGA | 3 | 2026-06-01 | ||||
| XC5VTX150T-2FFG1759I | XILINX/赛灵思 | BGA | 98 | 2026-06-01 | ||||
| XC5VLX110T-1FF1136C | XILINX/赛灵思 | BGA | 130 | 2026-06-01 | ||||
| XC4VLX40-10FF1148C | XILINX/赛灵思 | BGA | 15 | 2026-06-01 | ||||
| SN74LVC1G04DCKR | TI/德州仪器 | SC70-5 | 14+ | 2957 | 2026-06-01 | |||
| SN74LVC2G08DCUR | TI/德州仪器 | VSSOP8 | 15+ | 15 | 2026-06-01 | |||
| SN74LVC1G04DCKR | TI/德州仪器 | SC70-5 | 13+ | 441 | 2026-06-01 | |||
| SN74LVC2G08DCUR | TI/德州仪器 | VSSOP8 | 19+ | 805 | 2026-06-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| BD5342G-TR | ROHM/罗姆 | SOT23-5 | 13+ | 2800 | 2026-06-01 | |||
| BM1Q001FJ-E2 | ROHM/罗姆 | SOP8 | 19+ | 169 | 2026-06-01 | |||
| MAX6400BS22+T | ADI/亚德诺 | WLCSP-4 | 193 | 2026-06-01 | ||||
| MAX809TEUR+T | MAXIM/美信 | SOT23-3 | 13+ | 1484 | 2026-06-01 | |||
| MAX6071BAUT30+T | MAXIM/美信 | SOT23-6 | 13+ | 15 | 2026-06-01 | |||
| S-1142B50I-E6T1U | ABLIC/艾普凌科 | HSOP-6 | 13+ | 800 | 2026-06-01 | |||
| S-1142B53I-E6T1U | ABLIC/艾普凌科 | HSOP-7 | 17+ | 1800 | 2026-06-01 | |||
| S-1142B50I-E6T1U | ABLIC/艾普凌科 | HSOP-6 | 15+ | 2000 | 2026-06-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| C0603X5R0J474MT00NE | TDK/东电化 | SMD | 19+ | 15000 | 2026-06-01 | |||
| GRM155R71C104KA88D | MURATA/村田 | SMD | 17+ | 10000 | 2026-06-01 | |||
| TMK316BJ475KL-T | TAIYO/太诱 | SMD | 06+ | 2000 | 2026-06-01 | |||
| C3216X5R0J106MT000N | TDK/东电化 | SMD | 06+ | 2000 | 2026-06-01 | |||
| JMK316BJ226ML-T | TAIYO/太诱 | SMD | 06+ | 2000 | 2026-06-01 | |||
| CL31A106MQHNNNE | SAMSUNG/三星 | SMD | 06+ | 2000 | 2026-06-01 | |||
| CL21A106KQFNNNE | SAMSUNG/三星 | SMD | 06+ | 2000 | 2026-06-01 | |||
| LMK212BJ225KG-T | TAIYO/太诱 | SMD | 07+ | 3000 | 2026-06-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| PIC16C73B-04I/SP | MICROCHIP/微芯 | DIP | 18+ | 819 | 2026-06-01 | |||
| PIC16C71-04/P | MICROCHIP/微芯 | DIP | 17+ | 352 | 2026-06-01 | |||
| ADL5565ACPZ | ADI/亚德诺 | QFN | 1100 | 2026-06-01 | ||||
| MC68HC705C8ACFNE | FREESCALE/飞思卡尔 | PLCC | 17+ | 5 | 2026-06-01 | |||
| PEMI6CSP/RW | NXP/恩智浦 | SMD | 12+ | 4000 | 2026-06-01 | |||
| TC74VHC14FK | TOSHIBA/东芝 | TSSOP14 | 20+ | 2500 | 2026-06-01 | |||
| TC74VHC157FK | TOSHIBA/东芝 | VSSOP16 | 20+ | 2500 | 2026-06-01 | |||
| L9369-TR | ST/意法 | QFP | 1866 | 2026-06-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MPC8548VTAUJD | FREESCALE/飞思卡尔 | BGA | 1 | 2026-06-01 | ||||
| STM32F103B6GK | ST/意法 | BAG | 31 | 2026-06-01 | ||||
| STM32F100B6GK | ST/意法 | BGA | 176 | 2026-06-01 | ||||
| STM32F091VCH7 | ST/意法 | BGA | 72 | 2026-06-01 | ||||
| STM32L151RBH6 | ST/意法 | BGA | 210 | 2026-06-01 | ||||
| ADUCM322BBCZI | ADI/亚德诺 | BGA | 3 | 2026-06-01 | ||||
| ADUC7028BBCZ62 | ADI/亚德诺 | BGA | 18 | 2026-06-01 | ||||
| STM32F098RCH6 | ST/意法 | BGA | 7 | 2026-06-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| 52271-3069 | MOLEX/莫仕 | Connector | 19+ | 1000 | 2026-06-01 | |||
| 5034800800 | MOLEX/莫仕 | Connector | 18+ | 3000 | 2026-06-01 | |||
| 5034802000 | MOLEX/莫仕 | Connector | 18+ | 3000 | 2026-06-01 | |||
| SCDAAA1000 | ALPS/阿尔卑斯 | connector | 16+ | 1000 | 2026-06-01 | |||
| FB10S061JT1R6000 | JAE/日本航空电子 | FPC | 18+ | 1166 | 2026-06-01 | |||
| FH35C-17S-0.3SHW(50) | HIROSE/广濑 | SMD | 18+ | 7251 | 2026-06-01 | |||
| FB10S027JT1R6000 | JAE/日本航空电子 | SMD | 18+ | 4553 | 2026-06-01 | |||
| FB10S021JT1R6000 | JAE/日本航空电子 | SMD | 18+ | 834 | 2026-06-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| SN75185DBR | TI/德州仪器 | SSOP20 | 15+ | 790 | 2026-06-01 | |||
| MAX3243EEAI+T | MAXIM/美信 | SSOP-28 | 14+ | 2122 | 2026-06-01 | |||
| GD75232N | TI/德州仪器 | PDIP20 | 08+ | 100 | 2026-06-01 | |||
| SN75185DBR | TI/德州仪器 | SSOP-20 | 06+ | 2000 | 2026-06-01 | |||
| SN75LVDS390PW | TI/德州仪器 | TSSOP-16 | 4415 | 2026-06-01 | ||||
| PCA9557PWR | TI/德州仪器 | TSSOP16 | 1687 | 2026-06-01 | ||||
| TSB83AA22CZAJ | TI/德州仪器 | TFBGA-168 | 13 | 2026-06-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| RFPA2016TR13 | QORVO | QFN | 14+ | 638 | 2026-06-01 | |||
| MAX2644EXT+T | MAXIM/美信 | SC70-6 | 13+ | 2500 | 2026-06-01 | |||
| MAX2644EXT+T | MAXIM/美信 | SC70-6 | 15+ | 13407 | 2026-06-01 | |||
| MAX2644EXT+T | MAXIM/美信 | SC70-6 | 14+ | 10000 | 2026-06-01 | |||
| SBB5089Z | QORVO | SOT89 | 18+ | 71 | 2026-06-01 | |||
| AD8346ARUZ | ADI/亚德诺 | TSOP16 | 24+ | 2688 | 2026-06-01 | |||
| AD8362ARUZ | ADI/亚德诺 | TSSOP16 | 31153 | 2026-06-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| LP3943ISQ/NOPB | TI/德州仪器 | QFN | 20 | 2026-06-01 | ||||
| EFM8BB10F8G-A-QFN20R | SILICON/芯科 | QFN | 300 | 2026-06-01 | ||||
| CAT9555YI-T2 | ONSEMI/安森美 | SOP | 50 | 2026-06-01 | ||||
| PIC16F677-I/SS | MICROCHIP/微芯 | SOP | 50 | 2026-06-01 | ||||
| PIC16F1503-I/SL | MICROCHIP/微芯 | SOP | 4 | 2026-06-01 | ||||
| TMPM363F10FG | TOSHIBA/东芝 | QFP | 200 | 2026-06-01 | ||||
| CYAT817AZS98-42002 | CYPRESS/赛普拉斯 | QFP | 50 | 2026-06-01 | ||||
| CY8C4245AXI-483 | CYPRESS/赛普拉斯 | QFP | 3 | 2026-06-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| TS4994IQT | ST/意法 | QFN | 200 | 2026-06-01 | ||||
| HMC963LC4TR | ADI/亚德诺 | QFN | 1 | 2026-06-01 | ||||
| LP3878SD-ADJ | TI/德州仪器 | QFN | 10 | 2026-06-01 | ||||
| ADA4930-1YCPZ | ADI/亚德诺 | QFN | 20 | 2026-06-01 | ||||
| PE42820MLBA-X | PSEMI/游隼 | QFN | 10 | 2026-06-01 | ||||
| KSZ8851SNLI | MICROCHIP/微芯 | QFN | 20 | 2026-06-01 | ||||
| ADP2116ACPZ | ADI/亚德诺 | QFN | 1 | 2026-06-01 | ||||
| LIS331DLHTR | ST/意法 | QFN | 20 | 2026-06-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| PIC16F677-I/SS | MICROCHIP/微芯 | SOP | 50 | 2026-06-01 | ||||
| EFM8BB10F8G-A-QFN20R | SILICON/芯科 | QFN | 300 | 2026-06-01 | ||||
| PIC16F1503-I/SL | MICROCHIP/微芯 | SOP | 4 | 2026-06-01 | ||||
| EFM8SB10F8G-A-QFN20R | SILICON/芯科 | QFN | 50 | 2026-06-01 | ||||
| EFM8SB20F16G-B-QFN24 | SILICON/芯科 | QFN | 5 | 2026-06-01 | ||||
| DSPIC33FJ128GP802-E/MM | MICROCHIP/微芯 | QFN | 20 | 2026-06-01 | ||||
| DSPIC33FJ128GP802-I/MM | MICROCHIP/微芯 | QFN | 30 | 2026-06-01 | ||||
| DSPIC30F2010-20E/MM | MICROCHIP/微芯 | QFN | 2 | 2026-06-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| TPS659112A2ZRCR | TI/德州仪器 | 100 | 2026-06-01 | |||||
| L9678P | ST/意法 | QFP | 20 | 2026-06-01 | ||||
| L9945 | ST/意法 | QFP | 4 | 2026-06-01 | ||||
| TPS659112A2ZRCR | TI/德州仪器 | BGA | 100 | 2026-06-01 | ||||
| MAX5992AETG+ | MAXIM/美信 | QFN | 500 | 2026-06-01 | ||||
| ISL61852EIRZ | RENESAS/瑞萨 | QFN | 500 | 2026-06-01 | ||||
| MAX16046ETN+T | MAXIM/美信 | QFN | 1 | 2026-06-01 | ||||
| MAX1979ETM+T | MAXIM/美信 | QFN | 10 | 2026-06-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| UPD720101F1-EA8 | NEC/日电电子 | 100 | 2026-06-01 | |||||
| MSP430FW427IPMR | TI/德州仪器 | QFP | 1000 | 2026-06-01 | ||||
| MSP430F5310IPTR | TI/德州仪器 | QFP | 20 | 2026-06-01 | ||||
| TMS320TCI6482ZTZ | TI/德州仪器 | 1000 | 2026-06-01 | |||||
| TPS84259RKGR | TI/德州仪器 | QFN | 1 | 2026-06-01 | ||||
| TPS65950A2 | TI/德州仪器 | 100 | 2026-06-01 | |||||
| AD9889BBSTZ-80 | ADI/亚德诺 | QFP | 1 | 2026-06-01 | ||||
| ADRF6820ACPZ | ADI/亚德诺 | QFN | 100 | 2026-06-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MAX4951CTP+T | MAXIM/美信 | QFN | 10 | 2026-06-01 | ||||
| SN74LVTH125RGYR | TI/德州仪器 | QFN | 300 | 2026-06-01 | ||||
| SN74LV4320AGKFR | TI/德州仪器 | 10 | 2026-06-01 | |||||
| XC95288XL-7FG256C | XILINX/赛灵思 | 2 | 2026-06-01 | |||||
| XC2VP20-5FFG1152C | XILINX/赛灵思 | 1 | 2026-06-01 | |||||
| XC2VP4-5FFG672C | XILINX/赛灵思 | 30 | 2026-06-01 | |||||
| XC4VLX15-10FFG668I | XILINX/赛灵思 | 2 | 2026-06-01 | |||||
| XC6VCX75T-1FFG484I | XILINX/赛灵思 | 30 | 2026-06-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| RDA1005LTR13 | QORVO | QFN | 300 | 2026-06-01 | ||||
| SZM3166Z | QORVO | QFN | 10 | 2026-06-01 | ||||
| MAX2309ETI+T | MAXIM/美信 | QFN | 10 | 2026-06-01 | ||||
| MAX9993ETP+T | MAXIM/美信 | QFN | 3000 | 2026-06-01 | ||||
| MMZ38333BT1 | NXP/恩智浦 | QFN | 5000 | 2026-06-01 | ||||
| TQP9108 | QORVO | QFN | 5 | 2026-06-01 | ||||
| RFDA0026TR13 | QORVO | QFN | 500 | 2026-06-01 | ||||
| CC1350F128RGZR | TI/德州仪器 | QFN | 20 | 2026-06-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| XCF08PFSG48C | XILINX/赛灵思 | 300 | 2026-06-01 | |||||
| XCF16PVOG48C | XILINX/赛灵思 | 200 | 2026-06-01 | |||||
| SDINBDA6-32G | SANDISK/闪迪 | 11 | 2026-06-01 | |||||
| XCF08PFSG48C | XILINX/赛灵思 | BGA | 300 | 2026-06-01 | ||||
| SDINBDA6-32G | SANDISK/闪迪 | BGA | 11 | 2026-06-01 | ||||
| GS864018GT-167 | GSI | QFP | 10 | 2026-06-01 | ||||
| IS61NLP25636A-250TQL | ISSI/芯成 | QFP | 200 | 2026-06-01 | ||||
| IS61C632A-7TQ | ISSI/芯成 | QFP | 50 | 2026-06-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| CAT9555YI-T2 | ONSEMI/安森美 | SOP | 50 | 2026-06-01 | ||||
| MAX7359ETG+T | MAXIM/美信 | QFN | 50 | 2026-06-01 | ||||
| PI3EQX12902AZLEX | DIODES/美台 | QFN | 3000 | 2026-06-01 | ||||
| MAX7301AAX+T | MAXIM/美信 | QFN | 20 | 2026-06-01 | ||||
| PTN3393BSY | NXP/恩智浦 | QFN | 100 | 2026-06-01 | ||||
| PCI2050BIZHK | TI/德州仪器 | BGA | 2 | 2026-06-01 | ||||
| AD9883AKSTZ-110 | ADI/亚德诺 | QFP | 10 | 2026-06-01 | ||||
| TUSB6250PFC | TI/德州仪器 | QFP | 1 | 2026-06-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MAX2009ETI | MAXIM/美信 | QFN | 5 | 2026-06-01 | ||||
| GD25Q32CWIG | GD/兆易创新 | QFN | 5 | 2026-06-01 | ||||
| W25Q32FVZPIG | WINBOND/华邦 | QFN | 30 | 2026-06-01 | ||||
| MT8321A | MTK/联发科 | BGA | 1 | 2026-06-01 | ||||
| S1D13506F00A2 | EPSON/爱普生 | QFP | 10 | 2026-06-01 | ||||
| TMP86FH47AUG | TOSHIBA/东芝 | QFP | 30 | 2026-06-01 | ||||
| CY62256NLL | CYPRESS/赛普拉斯 | SOP | 2 | 2026-06-01 | ||||
| HY5DU561622ETP-J | SKHYNIX/海力士 | SOP | 30 | 2026-06-01 |